# Arising Electronics

Manufacturer, service provider in Bengaluru, Karnataka. Last updated 2026-10-11; site last checked 2026-10-11. Gathered from the business's own website. **Not verified by the business.**

Electronics manufacturing services provider in Bangalore, Karnataka. It does contract manufacturing of electronic assemblies (SMT/SMD/through-hole and mixed technology), from prototypes to production volumes, including build-to-print.

## How to reach this business

- Best route for an agent: email — razack@arisingelectronics.com
- Include in your first message: Project requirements (build to print or design to production); PCB specification and BOM; Quantity or volume
- Typical way to start: contact only
- Some numbers on their site belong to individuals and are not shown here.

_A way to send an enquiry through this directory is planned. Until then, use the routes above._

## At a glance

| | |
| --- | --- |
| Website | https://arisingelectronics.com |
| Established | 2014 |
| Languages | en |
| Factory | No.659, M.V.S Arcade, 5th Main, OMBR Layout, Opp.B.Channasandra Bus stop, Banaswadi, Bangalore – 560 043, Karnataka, India. |
| Certification (as claimed) | ISO 9001:2015 (I-QSC202005004) |

## What they offer

### PCB assembly (SMT/SMD/TH) and EMS (custom production)

Automated and manual assembly of PCBs, prototype to production, build to print and design to production.

**Volumes**
- Prototype for R&D
- Small quantity 1-50
- Pilot production 1-250
- Mid volume up to 5k
- Production up to 10k

**Density**
- Up to 2345+ components per board
- Min device pitch 10 mils; ball count 8 to 1932

## More about this business

**Machines**
- Yamaha YSM10 pick and place, 25000 CPH, ±0.05mm/chip mounting accuracy
- Heller 1707 MK III 7-zone reflow oven
- Martin 10.6 rework station (FPGA, flip-chip, QFN, LGA)
- BYS BY350A PCB conveyor
- Baking oven for moisture-sensitive devices and bare PCBs

**Capabilities**
- BGA, Flip Chip BGA, LGA, POP and Micro BGA assembly; packages from 01005
- Press-fit connector assembly
- RoHS and non-RoHS soldering
- IPC 610 Class II and III, IPC J-STD-001
- Rigid, flex, flex-rigid-flex, aluminium and metal-core PCBs, 2 to 24 layers, 0.6 to 5mm thick, 20x20mm to 400x360mm

**Industries**
- Automotive, aerospace, medical, OEMs, consumer, IT and ITES

**Quality**
- ISO 9001:2015
- IPC-trained staff

## Sources

- https://arisingelectronics.com/src/about.html (fetched 2026-10-11)
- https://arisingelectronics.com/src/contact.html (fetched 2026-10-11)
- https://arisingelectronics.com/src/services.html (fetched 2026-10-11)