# Sienna Ecad Technologies

Service provider, manufacturer in Bengaluru, Karnataka. Last updated 2026-10-11; site last checked 2026-10-11. Gathered from the business's own website. **Not verified by the business.**

Bengaluru-based PCB design and analysis engineering company. It also offers quick-turn prototype PCB assembly through PCBA facilities of its parent EMS group in Bangalore, Chennai and Atlanta.

## How to reach this business

- Best route for an agent: email — sales@siennaecad.com (sales)
- Other routes: phone +91 9019225498; phone +91 80 3501 8800
- Include in your first message: Design files / requirement description; Quantity; Board layers and assembly type
- Typical way to start: contact only

_A way to send an enquiry through this directory is planned. Until then, use the routes above._

## At a glance

| | |
| --- | --- |
| Website | https://siennaecad.com |
| Legal name | SIENNA ECAD Technologies |
| Service area | Clients across the globe |
| Languages | en |
| Office | #683, 1st Floor, 15th Cross Rd Outer Ring Road, Near Delmia circle JP Nagar 2nd Phase, Bengaluru - 560078, Karnataka, India. |
| Office | #23, JK Tech Square, EPIP Zone, Whitefield, Bengaluru – 560066, Karnataka, India. |

## What they offer

### PCB design and analysis (service)

High-speed PCB design, SI, thermal, EMI/EMC and reliability analysis, DFX and library support.

### Quick turn prototype PCB assembly (custom production)

Prototype and low to medium volume PCB assembly (SMT, through-hole, mixed) at group facilities in Bangalore, Chennai and Atlanta.

**Capabilities**
- Hi-complex double-sided assemblies, backplanes
- ROHS and conventional process
- AOI, in-circuit and flying probe test
- DFM reviews and yield analysis
- IPC Class 2/3, MILSPEC
- Conformal coating, encapsulation, total traceability

## More about this business

**Services**
- PCB design, library support, analysis (SI, thermal, EMI/EMC, reliability), DFX, quick turn prototype

**PCB assembly capability**
- SMT, through-hole and mixed technology, backplanes, high-mix low to medium volume
- AOI, in-circuit and flying probe test, conformal coating, encapsulation, total traceability
- IPC Class 2 and Class 3, MILSPEC
- Up to 24 layers, thickness up to 4.1 mm, 01005 components, BGAs at 0.4 mm pitch, up to 10k components per PCBA

**Industries**
- Networking, Power, Transportation, Semiconductor, IOT, Medical

**Ownership**
- Parent companies Sienna Corporation and Avalon Technologies (EMS providers in USA/India)

**Customers**
- Clients include a US-headquartered semiconductor fab company; testimonials mention design, fabrication and assembly support

**Export**
- Works with clients globally

## Sources

- https://siennaecad.com/prototype.html (fetched 2026-10-11)
- https://siennaecad.com/about.html (fetched 2026-10-11)
- https://siennaecad.com/ (fetched 2026-10-11)